MSM832TMB-025 vs IS61C256AH-25NI feature comparison

MSM832TMB-025 Mosaic Semiconductor Inc

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IS61C256AH-25NI Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC INTEGRATED SILICON SOLUTION INC
Part Package Code DIP DIP
Package Description , 0.300 INCH, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-CDIP-T28 R-PDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 35.306 mm
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP28,.3
Seated Height-Max 4.572 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare MSM832TMB-025 with alternatives

Compare IS61C256AH-25NI with alternatives