MT54V512H18EF-6 vs MT58L512L18DF-7.5IT feature comparison

MT54V512H18EF-6 Micron Technology Inc

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MT58L512L18DF-7.5IT Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1 MM PITCH, FBGA-165 TBGA,
Pin Count 165 165
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 4 Weeks
Access Time-Max 2.5 ns 4 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type QDR SRAM STANDARD SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 2
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX18 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.17 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.35 mA
Supply Voltage-Max (Vsup) 2.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1

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Compare MT58L512L18DF-7.5IT with alternatives