MT54W512H36JF-6 vs MCM69L818CZP7.5R feature comparison

MT54W512H36JF-6 Micron Technology Inc

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MCM69L818CZP7.5R Freescale Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1 MM PITCH, FBGA-165 BGA,
Pin Count 165 119
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 4 Weeks
Access Time-Max 0.5 ns 7.5 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e0
Length 15 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type QDR SRAM LATE-WRITE SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.4 mm
Standby Current-Max 0.155 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 1.9 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 1

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