MT58L256V32PF-6 vs MT58L256L32PF-7.5IT feature comparison

MT58L256V32PF-6 Micron Technology Inc

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MT58L256L32PF-7.5IT Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 13 X 15 MM, FBGA-165 TBGA,
Pin Count 165 165
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 4 Weeks
Access Time-Max 3.5 ns 4 ns
Additional Feature PIPELINED ARCHITECTURE
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX32 256KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.475 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 1

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Compare MT58L256L32PF-7.5IT with alternatives