NB3L553DG
vs
ICS553MILFT
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC-8 Narrow Body
|
|
| Package Description |
SOIC-8
|
0.150 INCH, ROHS COMPLIANT, SOIC-8
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
751-07
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
13 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
ALSO OPERATES AT 3.3V OR 5V SUPPLY
|
|
| Family |
3L
|
553
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4.9 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Max I(ol) |
0.035 A
|
0.035 A
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
8
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
5 ns
|
4 ns
|
| Propagation Delay (tpd) |
5 ns
|
5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.05 ns
|
0.05 ns
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Technology |
|
CMOS
|
| fmax-Min |
|
200 MHz
|
|
|
|
Compare NB3L553DG with alternatives
Compare ICS553MILFT with alternatives