NCX2200GS
vs
NCX2202GMZ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
BCC,
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Input Offset Voltage-Max |
30000 µV
|
|
| JESD-30 Code |
S-XBCC-B6
|
|
| Length |
1 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Type |
PUSH-PULL
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
BCC
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Response Time-Nom |
800 ns
|
|
| Seated Height-Max |
0.35 mm
|
|
| Supply Voltage Limit-Max |
7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BUTT
|
|
| Terminal Pitch |
0.35 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
1 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
13 Weeks
|
| Date Of Intro |
|
2019-11-21
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR, 7 INCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NCX2200GS with alternatives
Compare NCX2202GMZ with alternatives