OMAP5910JGZG2
vs
OMAP5910JZZG2
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-289
|
TFBGA, BGA289,21X21,20
|
| Pin Count |
289
|
289
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 2.75V OR 3.3V SUPPLY
|
ALSO REQUIRES 2.75V OR 3.3V SUPPLY
|
| Address Bus Width |
25
|
25
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
13 MHz
|
13 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
| JESD-609 Code |
e0
|
e1
|
| Length |
12 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of DMA Channels |
6
|
6
|
| Number of Terminals |
289
|
289
|
| Number of Timers |
8
|
8
|
| On Chip Program ROM Width |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA289,21X21,20
|
BGA289,21X21,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
220
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
163840
|
163840
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.675 V
|
1.675 V
|
| Supply Voltage-Min |
1.525 V
|
1.525 V
|
| Supply Voltage-Nom |
1.6 V
|
1.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, MIXED
|
DIGITAL SIGNAL PROCESSOR, MIXED
|
| Base Number Matches |
1
|
1
|
|
|
|