P89LPC932A1FDH,529 vs P89LPC932A1FN feature comparison

P89LPC932A1FDH,529 NXP Semiconductors

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P89LPC932A1FN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP2 DIP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28 DIP, DIP28,.6
Pin Count 28 28
Manufacturer Package Code SOT361-1
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 R-PDIP-T28
JESD-609 Code e4 e3/e4
Length 9.7 mm 35.5 mm
Moisture Sensitivity Level 3
Number of I/O Lines 26 26
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.1 mm 5.1 mm
Speed 12 MHz 12 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.4 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN/NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
CPU Family 8051
On Chip Program ROM Width 8
Package Equivalence Code DIP28,.6
RAM (bytes) 768
ROM (words) 8192
Supply Current-Max 23 mA

Compare P89LPC932A1FDH,529 with alternatives

Compare P89LPC932A1FN with alternatives