P89LPC932A1FDH,529 vs P89LPC932BA feature comparison

P89LPC932A1FDH,529 NXP Semiconductors

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P89LPC932BA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP2 LCC
Package Description 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28 QCCJ, LDCC28,.5SQ
Pin Count 28 28
Manufacturer Package Code SOT361-1
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 S-PQCC-J28
JESD-609 Code e4
Length 9.7 mm 11.5062 mm
Moisture Sensitivity Level 3
Number of I/O Lines 26 26
Number of Terminals 28 28
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.1 mm 4.57 mm
Speed 12 MHz 12 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.4 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 11.5062 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
CPU Family 8051
On Chip Program ROM Width 8
Package Equivalence Code LDCC28,.5SQ
RAM (bytes) 768
ROM (words) 8192
Supply Current-Max 18 mA

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