PC28F640J3C-115
vs
AM29LV640DU121RPCE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEL CORP
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, BGA-64
13 X 11 MM, 1 MM PITCH, FBGA-64
Pin Count
64
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
115 ns
120 ns
Alternate Memory Width
8
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Type
NOR TYPE
NOR TYPE
Width
10 mm
11 mm
Base Number Matches
2
2
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e0
Number of Sectors/Size
128
Package Equivalence Code
BGA64,8X8,40
Ready/Busy
YES
Sector Size
32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Toggle Bit
YES
Compare PC28F640J3C-115 with alternatives
Compare AM29LV640DU121RPCE with alternatives