PC28F640J3C-115 vs AM29LV640DU121RPCE feature comparison

PC28F640J3C-115 Intel Corporation

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AM29LV640DU121RPCE AMD

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEL CORP ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description LEAD FREE, BGA-64 13 X 11 MM, 1 MM PITCH, FBGA-64
Pin Count 64 64
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 115 ns 120 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE NOR TYPE
Width 10 mm 11 mm
Base Number Matches 2 2
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Number of Sectors/Size 128
Package Equivalence Code BGA64,8X8,40
Ready/Busy YES
Sector Size 32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Terminal Finish Tin/Lead (Sn/Pb)
Toggle Bit YES

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Compare AM29LV640DU121RPCE with alternatives