PC28F640J3C-115
vs
PF38F20L0YUC0
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
BGA
BGA
Package Description
LEAD FREE, BGA-64
8 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, VFBGA-88
Pin Count
64
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
115 ns
Alternate Memory Width
8
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
10 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
2 V
Supply Voltage-Min (Vsup)
2.7 V
1.7 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Type
NOR TYPE
NOR TYPE
Width
10 mm
8 mm
Base Number Matches
2
1
Boot Block
TOP
Clock Frequency-Max (fCLK)
54 MHz
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
TIN SILVER COPPER
Compare PC28F640J3C-115 with alternatives
Compare PF38F20L0YUC0 with alternatives