PC8349EMTPYALFB vs MPC8347EZUAJDA feature comparison

PC8349EMTPYALFB e2v technologies

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MPC8347EZUAJDA NXP Semiconductors

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD NXP SEMICONDUCTORS
Part Package Code BGA
Package Description LBGA, 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
Pin Count 672
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 1.14 V MINIMUM SUPPLY AT 533 MHZ ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B672 S-PBGA-B672
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 672 672
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Seated Height-Max 1.69 mm 1.69 mm
Speed 667 MHz 533 MHz
Supply Voltage-Max 1.3625 V 1.26 V
Supply Voltage-Min 1.24 V 1.14 V
Supply Voltage-Nom 1.3 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Rohs Code No
Moisture Sensitivity Level 1
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Equivalence Code BGA672,34X34,40
Qualification Status Not Qualified
Temperature Grade OTHER

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