PCA9540BD,118
vs
PCA9540BDP/Q900J
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
|
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
SOT96-1
|
SOT505-1
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
18 Weeks
|
19 Weeks
|
Samacsys Manufacturer |
NXP
|
NXP
|
Additional Feature |
ALSO OPERATES WITH 3.6 TO 5.5V SUPPLY
|
|
Family |
9540
|
|
JESD-30 Code |
R-PDSO-G8
|
|
JESD-609 Code |
e4
|
|
Length |
4.9 mm
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
|
Number of Inputs |
2
|
|
Number of Outputs |
1
|
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
SOP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Packing Method |
TR, 13 INCH
|
TR, 13 INCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
0.3 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PCA9540BD,118 with alternatives
Compare PCA9540BDP/Q900J with alternatives