PI7C7300DNA
vs
PCI2050APDVG4
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA272,20X20,50
|
QFP, QFP208,1.2SQ,20
|
Pin Count |
272
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
|
Clock Frequency-Max |
66 MHz
|
|
External Data Bus Width |
32
|
|
JESD-30 Code |
S-PBGA-B272
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e4
|
Length |
27 mm
|
|
Number of Terminals |
272
|
208
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
QFP
|
Package Equivalence Code |
BGA272,20X20,50
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
27 mm
|
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare PI7C7300DNA with alternatives
Compare PCI2050APDVG4 with alternatives