PIC16F721-E/ML
vs
PIC16LF721-E/P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
0.300 INCH, LEAD FREE, PLASTIC, DIP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 1.8 V SUPPLY AT 16 MHZ
|
|
| Address Bus Width |
8
|
|
| Bit Size |
8
|
8
|
| CPU Family |
PIC
|
PIC16
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-N20
|
R-PDIP-T20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
26.162 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
18
|
18
|
| Number of Terminals |
20
|
20
|
| On Chip Program ROM Width |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
DIP20,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
256
|
| ROM (words) |
7168
|
4096
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
5.334 mm
|
| Speed |
20 MHz
|
16 MHz
|
| Supply Current-Max |
4.1 mA
|
3.9 mA
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
6 Weeks
|
| Boundary Scan |
|
NO
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
YES
|
| Number of External Interrupts |
|
1
|
| Number of Serial I/Os |
|
1
|
| Number of Timers |
|
4
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare PIC16F721-E/ML with alternatives
Compare PIC16LF721-E/P with alternatives