R5F101ACASP#X0
vs
R5F101ACASP#30
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
LSSOP
|
LSSOP
|
Package Description |
LSSOP,
|
LSSOP,
|
Pin Count |
30
|
30
|
Manufacturer Package Code |
PLSP0030JB
|
PLSP0030JB
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Has ADC |
YES
|
|
Additional Feature |
IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
|
|
Address Bus Width |
|
|
Bit Size |
16
|
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
20 MHz
|
|
DAC Channels |
NO
|
|
DMA Channels |
YES
|
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G30
|
|
Length |
9.85 mm
|
|
Number of I/O Lines |
26
|
|
Number of Terminals |
30
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LSSOP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
RAM (bytes) |
2048
|
|
ROM (words) |
32768
|
|
ROM Programmability |
FLASH
|
|
Seated Height-Max |
1.4 mm
|
|
Speed |
32 MHz
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
6.1 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, CISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare R5F101ACASP#X0 with alternatives
Compare R5F101ACASP#30 with alternatives