R5F364AEDFB#V2
vs
R5F364AENFB#30
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LQFP
|
LQFP
|
| Pin Count |
100
|
100
|
| Manufacturer Package Code |
PLQP0100KB
|
PLQP0100KB
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Moisture Sensitivity Level |
3
|
1
|
| Technology |
CMOS
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
QFP, QFP100,.63SQ,20
|
| Factory Lead Time |
|
12 Weeks
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
20
|
| Bit Size |
|
16
|
| CPU Family |
|
M16C
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
16
|
| JESD-30 Code |
|
S-PQFP-G100
|
| JESD-609 Code |
|
e3
|
| Length |
|
14 mm
|
| Number of I/O Lines |
|
85
|
| Number of Terminals |
|
100
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QFP
|
| Package Equivalence Code |
|
QFP100,.63SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
20480
|
| ROM (words) |
|
262144
|
| ROM Programmability |
|
FLASH
|
| Speed |
|
25 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
14 mm
|
|
|
|
Compare R5F364AEDFB#V2 with alternatives
Compare R5F364AENFB#30 with alternatives