S29GL032N11FFIV22 vs S29GL032M11FFIR43 feature comparison

S29GL032N11FFIV22 Infineon Technologies AG

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S29GL032M11FFIR43 AMD

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG ADVANCED MICRO DEVICES INC
Reach Compliance Code compliant unknown
Access Time-Max 110 ns 110 ns
Alternate Memory Width 8 8
Boot Block BOTTOM/TOP BOTTOM
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B64 S-PBGA-B64
JESD-609 Code e1
Length 13 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 64 8,63
Number of Terminals 64 64
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA64,8X8,40 BGA64,8X8,40
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Page Size 8/16 words 4/8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.4 mm
Sector Size 64K 8K,64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 11 mm
Base Number Matches 3 2
Package Description BGA, BGA64,8X8,40
ECCN Code EAR99
HTS Code 8542.32.00.51

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