SC16C554DBIA68,518 vs SC16C554DBIA68 feature comparison

SC16C554DBIA68,518 NXP Semiconductors

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SC16C554DBIA68 Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code LCC
Package Description QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ
Pin Count 68
Manufacturer Package Code SOT188-2
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e3
Length 24.23 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Number of Terminals 68 68
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 24.23 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2

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