SE5534FKB
vs
SA5534P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
QCCN,
|
ROHS COMPLIANT, PLASTIC, DIP-8
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
1.5 µA
|
2 µA
|
| Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
| Input Offset Voltage-Max |
3000 µV
|
4000 µV
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
8.89 mm
|
9.59 mm
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
5.08 mm
|
| Slew Rate-Nom |
13 V/us
|
13 V/us
|
| Supply Voltage Limit-Max |
22 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Unity Gain BW-Nom |
10000
|
10000
|
| Width |
8.89 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
1.5 µA
|
| Common-mode Reject Ratio-Min |
|
70 dB
|
| Frequency Compensation |
|
YES (AVCL>=3)
|
| Input Offset Current-Max (IIO) |
|
0.3 µA
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Package Equivalence Code |
|
DIP8,.3
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Supply Current-Max |
|
8 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Voltage Gain-Min |
|
15000
|
| Wideband |
|
NO
|
|
|
|
Compare SE5534FKB with alternatives
Compare SA5534P with alternatives