SI4463-BXX-FMR
vs
3D3523-20
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
DATA DELAY DEVICES INC
|
| Package Description |
HVQCCN,
|
DIP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Telecom IC Type |
TELECOM CIRCUIT
|
MANCHESTER ENCODER/DECODER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| JESD-30 Code |
|
R-PDIP-T14
|
| Length |
|
19.305 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
Compare SI4463-BXX-FMR with alternatives
Compare 3D3523-20 with alternatives