SI4464-B1B-FMR vs 3D3523-0.5 feature comparison

SI4464-B1B-FMR Silicon Laboratories Inc

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3D3523-0.5 Data Delay Devices Inc

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer SILICON LABORATORIES INC DATA DELAY DEVICES INC
Package Description QFN-20 DIP,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-XQCC-N20 R-PDIP-T14
JESD-609 Code e3
Length 4 mm 19.305 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 20 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Seated Height-Max 0.9 mm 4.57 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES NO
Telecom IC Type MANCHESTER ENCODER/DECODER MANCHESTER ENCODER/DECODER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position QUAD DUAL
Width 4 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Technology CMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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