SI4464-B1B-FMR
vs
3D3523-0.5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
SILICON LABORATORIES INC
DATA DELAY DEVICES INC
Package Description
QFN-20
DIP,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQCC-N20
R-PDIP-T14
JESD-609 Code
e3
Length
4 mm
19.305 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
20
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Seated Height-Max
0.9 mm
4.57 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
NO
Telecom IC Type
MANCHESTER ENCODER/DECODER
MANCHESTER ENCODER/DECODER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
4 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
DIP
Pin Count
14
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SI4464-B1B-FMR with alternatives
Compare 3D3523-0.5 with alternatives