SI53325-B-GQ
vs
SI53325-B-GMR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SKYWORKS SOLUTIONS INC
|
| Part Package Code |
QFP
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Additional Feature |
ALSO OPERATES AT 3.3 V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
| Family |
53325
|
53325
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQCC-N32
|
| Length |
7 mm
|
5 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
2
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
32
|
32
|
| Number of True Outputs |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLQFP
|
HVQCCN
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
1 ns
|
1 ns
|
| Propagation Delay (tpd) |
1 ns
|
1 ns
|
| Qualification Status |
Not Qualified
|
|
| Same Edge Skew-Max (tskwd) |
0.06 ns
|
0.06 ns
|
| Seated Height-Max |
1.6 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
2.63 V
|
2.63 V
|
| Supply Voltage-Min (Vsup) |
2.38 V
|
2.38 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare SI53325-B-GQ with alternatives
Compare SI53325-B-GMR with alternatives