SN74LVC1G02DRY2
vs
74LVC1G00GV-Q100H
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NEXPERIA
|
| Part Package Code |
SON
|
TSOP
|
| Package Description |
GREEN, PLASTIC, MO-287UFAD, SON-6
|
TSSOP,
|
| Pin Count |
6
|
5
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.45 mm
|
2.9 mm
|
| Logic IC Type |
NOR GATE
|
NAND GATE
|
| Max I(ol) |
0.032 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
9 ns
|
10.5 ns
|
| Seated Height-Max |
0.6 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT753
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Nexperia
|
| Packing Method |
|
TR, 7 INCH
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare SN74LVC1G02DRY2 with alternatives
Compare 74LVC1G00GV-Q100H with alternatives