SN74LVC1G02YEAR
vs
HD74LVC1G02CPE
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DSBGA
|
BGA
|
| Package Description |
MO-211EA, DSBGA-5
|
VFBGA,
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-XBGA-B5
|
R-PBGA-B5
|
| Length |
1.4 mm
|
1.4 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA5,2X3,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
4.5 ns
|
|
| Propagation Delay (tpd) |
8 ns
|
8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
0.5 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.9 mm
|
0.9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SN74LVC1G02YEAR with alternatives
Compare HD74LVC1G02CPE with alternatives