SSM2302CPZ-REEL7
vs
MAX9722AETE+
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
LFCSP-16
|
HVQCCN, LCC16,.12SQ,20
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
CP-16-3
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
20 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
12 dB
|
|
Harmonic Distortion |
10%
|
|
JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.53 W
|
0.13 W
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
SOLCC16,.12,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
8
|
Supply Current-Max |
|
13 mA
|
Technology |
|
BICMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SSM2302CPZ-REEL7 with alternatives
Compare MAX9722AETE+ with alternatives