ST68C454CJ68 vs SC16C554BIBM,157 feature comparison

ST68C454CJ68 Exar Corporation

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SC16C554BIBM,157 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer EXAR CORP NXP SEMICONDUCTORS
Part Package Code LCC QFP
Package Description QCCJ, LDCC68,1.0SQ LFQFP, QFP64,.35SQ,16
Pin Count 68 64
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 3.3V SUPPLY ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5 3
Boundary Scan NO NO
Clock Frequency-Max 24 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.1875 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQFP-G64
JESD-609 Code e0 e3
Length 24.2316 mm 7 mm
Number of Serial I/Os 4 4
Number of Terminals 68 64
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC68,1.0SQ QFP64,.35SQ,16
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.6 mm
Supply Voltage-Max 5.5 V 3.63 V
Supply Voltage-Min 4.5 V 2.97 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.4 mm
Terminal Position QUAD QUAD
Width 24.2316 mm 7 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Manufacturer Package Code SOT414-1
Low Power Mode NO
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare SC16C554BIBM,157 with alternatives