STM32F103ZEH7TR
vs
STM32F103ZEH6
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-144
|
LFBGA-144
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
10 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
CORTEX-M3
|
CORTEX-M3
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| Length |
10 mm
|
10 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
12
|
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
112
|
112
|
| Number of Terminals |
144
|
144
|
| Number of Timers |
11
|
7
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA144,12X12,32
|
BGA144,12X12,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
65536
|
65536
|
| ROM (words) |
524288
|
524288
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
72 MHz
|
72 MHz
|
| Supply Current-Max |
70 mA
|
70 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
|
|
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