SY10EP52VKI vs MC10EP52DT feature comparison

SY10EP52VKI Microchip Technology Inc

Buy Now Datasheet

MC10EP52DT onsemi

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ONSEMI
Part Package Code MSOP SOIC
Package Description MSOP-8 PLASTIC, TSSOP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NECL MODE OPERATING RANGE: VCC=0V, VEE=-3.3V TO -5.5V NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
Family 10E 10E
JESD-30 Code S-PDSO-G8 S-PDSO-G8
Length 3 mm 3 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 8 8
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 0.38 ns 0.38 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.63 V 5.5 V
Supply Voltage-Min (Vsup) 2.97 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology ECL ECL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 3 mm 3 mm
fmax-Min 4000 MHz
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Factory Lead Time 4 Weeks
JESD-609 Code e0
Max Frequency@Nom-Sup 4000000000 Hz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code TSSOP8,.19
Packing Method RAIL
Peak Reflow Temperature (Cel) 235
Power Supply Current-Max (ICC) 47 mA
Prop. Delay@Nom-Sup 0.41 ns
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn90Pb10)
Time@Peak Reflow Temperature-Max (s) 30

Compare SY10EP52VKI with alternatives

Compare MC10EP52DT with alternatives