SY87700ALHG-TR
vs
MAX3872ETJ+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Package Description |
TQFP-32
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
9 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Analog Devices
|
| Applications |
ATM; SDH; SONET
|
SDH; SONET
|
| JESD-30 Code |
S-PQFP-G32
|
S-XQCC-N32
|
| Length |
7 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP32,.35SQ,32
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Supply Current-Max |
160 mA
|
0.215 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
7 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
32-LFCSP-5X5X0.75
|
| Pin Count |
|
32
|
| Manufacturer Package Code |
|
32-LFCSP-5X5X0.75
|
| Date Of Intro |
|
2003-02-25
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare SY87700ALHG-TR with alternatives
Compare MAX3872ETJ+T with alternatives