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TB2926HQ vs TDA8594SD/N1S,112 feature comparison

TB2926HQ Toshiba America Electronic Components

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TDA8594SD/N1S,112 NXP Semiconductors

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Part Life Cycle Code Active End Of Life
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code ZIP ZIP
Package Description 1 MM PITCH, PLASTIC, HZIP-25 ZIP, ZIP27H,.1,.74,40
Pin Count 25 27
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type AUDIO AMPLIFIER AUDIO AMPLIFIER
Harmonic Distortion 10% 10%
JESD-30 Code R-PZFM-T25 R-PZFM-T27
Number of Channels 4 4
Number of Functions 1 1
Number of Terminals 25 27
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 26 W 75 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code ZIP ZIP
Package Equivalence Code ZIP25,.16,.16,40 ZIP27H,.1,.74,40
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Qualification Status Not Qualified Not Qualified
Supply Current-Max 320 mA 400 mA
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 8 V 8 V
Surface Mount NO NO
Technology BICMOS BCDMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1 mm 1 mm
Terminal Position ZIG-ZAG ZIG-ZAG
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT878-1
Samacsys Manufacturer NXP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Consumer Circuits » Audio/Video Amplifiers
Consumer Circuits » Audio/Video Amplifiers

Compare TB2926HQ with alternatives

Compare TDA8594SD/N1S,112 with alternatives