TJA1028TK/3V3/20
vs
BU-67402F80L-300Y
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
DATA DEVICE CORP
|
| Part Package Code |
SON
|
|
| Package Description |
HVSON,
|
QFF,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PDSO-N8
|
S-PDFP-F36
|
| Length |
3 mm
|
25.4 mm
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
36
|
| Number of Transceivers |
1
|
2
|
| Operating Temperature-Max |
150 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
QFF
|
| Package Equivalence Code |
SOLCC8,.12,25
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
6.35 mm
|
| Supply Voltage-Nom |
12 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
LIN TRANSCEIVER
|
MIL-STD-1553 DATA BUS TRANSCEIVER
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
25.4 mm
|
| Base Number Matches |
4
|
1
|
| Date Of Intro |
|
2016-04-08
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare TJA1028TK/3V3/20 with alternatives
Compare BU-67402F80L-300Y with alternatives