TL16C552AFNG4 vs SC16C650AIN40,112 feature comparison

TL16C552AFNG4 Texas Instruments

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SC16C650AIN40,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code LCC DIP
Package Description LCC-68 DIP, DIP40,.6
Pin Count 68 40
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Date Of Intro 1990-12-01
Samacsys Manufacturer Texas Instruments
Additional Feature ENHANCED BIDIRECTIONAL PRINTER PORT ALSO OPERATES AT 2.5V MINIMUM SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Bus Compatibility IBM PC-AT
Clock Frequency-Max 16 MHz 48 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.125 MBps 0.375 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 R-PDIP-T40
JESD-609 Code e4
Length 24.23 mm 52 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of Serial I/Os 2 1
Number of Terminals 68 40
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC68,1.0SQ DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.7 mm
Supply Current-Max 50 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Width 24.23 mm 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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