TLV6002IDGKT
vs
MCP6002T-I/ST
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TSSOP,
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2016-06-19
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.000076 µA
|
|
Bias Current-Max (IIB) @25C |
0.000076 µA
|
|
Common-mode Reject Ratio-Min |
60 dB
|
|
Common-mode Reject Ratio-Nom |
76 dB
|
76 dB
|
Input Offset Voltage-Max |
4500 µV
|
4500 µV
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e3
|
Length |
3 mm
|
5 mm
|
Moisture Sensitivity Level |
2
|
|
Neg Supply Voltage Limit-Max |
-3.5 V
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.1 mm
|
1.2 mm
|
Slew Rate-Nom |
0.5 V/us
|
0.6 V/us
|
Supply Current-Max |
0.2 mA
|
|
Supply Voltage Limit-Max |
3.5 V
|
7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Unity Gain BW-Nom |
1000
|
1000
|
Width |
3 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Technology |
|
CMOS
|
|
|
|
Compare TLV6002IDGKT with alternatives
Compare MCP6002T-I/ST with alternatives