TLV9062IDGKR
vs
MCP6022-E/SL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VSSOP-8
|
SOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2018-04-07
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
5e-7 µA
|
0.005 µA
|
| Common-mode Reject Ratio-Min |
80 dB
|
|
| Common-mode Reject Ratio-Nom |
103 dB
|
90 dB
|
| Input Offset Voltage-Max |
1600 µV
|
2500 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
8.65 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Slew Rate-Nom |
6.5 V/us
|
7 V/us
|
| Supply Current-Max |
1.5 mA
|
|
| Supply Voltage Limit-Max |
6 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
10000
|
10000
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare TLV9062IDGKR with alternatives
Compare MCP6022-E/SL with alternatives