TLV9064IPWR
vs
TLV9064IRUCR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP-14
|
QFN-14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2017-12-24
|
2018-12-17
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
5e-7 µA
|
5e-7 µA
|
| Common-mode Reject Ratio-Min |
80 dB
|
80 dB
|
| Common-mode Reject Ratio-Nom |
103 dB
|
103 dB
|
| Input Offset Voltage-Max |
1600 µV
|
1600 µV
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N14
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
2 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.2 mm
|
0.4 mm
|
| Slew Rate-Nom |
6.5 V/us
|
6.5 V/us
|
| Supply Current-Max |
3 mA
|
3 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Unity Gain BW-Nom |
10000
|
10000
|
| Width |
4.4 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare TLV9064IPWR with alternatives
Compare TLV9064IRUCR with alternatives