TMMDB3TG
vs
HT-5761AR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TECCOR ELECTRONICS INC
|
| Part Package Code |
MELF
|
|
| Package Description |
MINIMELF-2
|
LONG FORM, O-LALF-W2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Factory Lead Time |
11 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Breakover Voltage-Max |
34 V
|
34 V
|
| Breakover Voltage-Min |
30 V
|
30 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Device Type |
DIAC
|
DIAC
|
| Base Number Matches |
1
|
5
|
| JEDEC-95 Code |
|
DO-35
|
|
|
|
Compare TMMDB3TG with alternatives
Compare HT-5761AR with alternatives