TSC2301IPAGRG4
vs
TSC2301IZQZ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
TFQFP, TQFP64,.47SQ
|
GREEN, PLASTIC, VFBGA-120
|
| Pin Count |
64
|
120
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B120
|
| JESD-609 Code |
e4
|
e1
|
| Length |
10 mm
|
6 mm
|
| Moisture Sensitivity Level |
4
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
120
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
VFBGA
|
| Package Equivalence Code |
TQFP64,.47SQ
|
BGA120,11X11,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
6 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare TSC2301IPAGRG4 with alternatives
Compare TSC2301IZQZ with alternatives