UM4301B
vs
UM4301C
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.60
|
Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
Application |
ATTENUATOR
|
ATTENUATOR
|
Breakdown Voltage-Min |
100 V
|
100 V
|
Case Connection |
ISOLATED
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
2.2 pF
|
2.2 pF
|
Diode Capacitance-Nom |
2.2 pF
|
2.2 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
1.5 Ω
|
1.5 Ω
|
Diode Res Test Current |
100 mA
|
100 mA
|
Diode Res Test Frequency |
150 MHz
|
150 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
Frequency Band |
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
|
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
|
JESD-30 Code |
O-XALF-W2
|
O-XUPM-N1
|
JESD-609 Code |
e0
|
e0
|
Minority Carrier Lifetime-Nom |
6 µs
|
6 µs
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
POST/STUD MOUNT
|
Power Dissipation-Max |
2.5 W
|
20 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
100 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Base Number Matches |
2
|
2
|
|
|
|
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