UM7301DE3
vs
UM7301DR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Additional Feature
LOW DISTORTION
LOW DISTORTION
Application
ATTENUATOR
ATTENUATOR
Breakdown Voltage-Min
100 V
100 V
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Capacitance-Max
0.7 pF
0.7 pF
Diode Element Material
SILICON
SILICON
Diode Forward Resistance-Max
3 Ω
3 Ω
Diode Type
PIN DIODE
PIN DIODE
Frequency Band
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 Code
O-XRPM-F2
O-XRPM-F2
Minority Carrier Lifetime-Nom
4 µs
4 µs
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
POST/STUD MOUNT
Power Dissipation-Max
6 W
6 W
Surface Mount
NO
NO
Technology
POSITIVE-INTRINSIC-NEGATIVE
POSITIVE-INTRINSIC-NEGATIVE
Terminal Form
FLAT
FLAT
Terminal Position
RADIAL
RADIAL
Base Number Matches
1
1
Rohs Code
No
Diode Capacitance-Nom
0.7 pF
Diode Res Test Current
100 mA
Diode Res Test Frequency
150 MHz
Operating Temperature-Max
175 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Reverse Test Voltage
100 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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