UM7301DE3 vs UM7301DR feature comparison

UM7301DE3 Microchip Technology Inc

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UM7301DR Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Additional Feature LOW DISTORTION LOW DISTORTION
Application ATTENUATOR ATTENUATOR
Breakdown Voltage-Min 100 V 100 V
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Capacitance-Max 0.7 pF 0.7 pF
Diode Element Material SILICON SILICON
Diode Forward Resistance-Max 3 Ω 3 Ω
Diode Type PIN DIODE PIN DIODE
Frequency Band HIGH FREQUENCY TO ULTRA HIGH FREQUENCY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 Code O-XRPM-F2 O-XRPM-F2
Minority Carrier Lifetime-Nom 4 µs 4 µs
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Power Dissipation-Max 6 W 6 W
Surface Mount NO NO
Technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal Form FLAT FLAT
Terminal Position RADIAL RADIAL
Base Number Matches 1 1
Rohs Code No
Diode Capacitance-Nom 0.7 pF
Diode Res Test Current 100 mA
Diode Res Test Frequency 150 MHz
Operating Temperature-Max 175 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Reverse Test Voltage 100 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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