UMX6002SM
vs
UM6002A
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Breakdown Voltage-Min |
200 V
|
200 V
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.5 pF
|
0.5 pF
|
| Diode Capacitance-Nom |
0.5 pF
|
0.5 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
1.7 Ω
|
1.7 Ω
|
| Diode Res Test Current |
100 mA
|
100 mA
|
| Diode Res Test Frequency |
100 MHz
|
100 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Minority Carrier Lifetime-Nom |
1 µs
|
1 µs
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Reverse Test Voltage |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Application |
|
ATTENUATOR; SWITCHING
|
| Frequency Band |
|
ULTRA HIGH FREQUENCY
|
| JESD-30 Code |
|
O-XEMW-N2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
ROUND
|
| Package Style |
|
MICROWAVE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power Dissipation-Max |
|
6 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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Compare UM6002A with alternatives