UPD301BT-I/KYX
vs
UPD301BT/KYX
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN, LCC40,.24SQ,20
|
HVQCCN, LCC40,.24SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Date Of Intro |
2020-04-13
|
2020-04-13
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
| Length |
6 mm
|
6 mm
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
LCC40,.24SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Current-Max (Isup) |
23.84 mA
|
23.84 mA
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Threshold Voltage-Nom |
+1.58V
|
+1.58V
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare UPD301BT-I/KYX with alternatives
Compare UPD301BT/KYX with alternatives