USB5537B-6080AKZE
vs
USB5537-AKZE-XX
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
10 X 10 MM, 0.50 MM PITCH, MO-220, QFN-72
|
QFN-72
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ALSO OPERATES AT 3.3 V SUPPLY
|
|
| Bus Compatibility |
I2C; SMBUS; SPI; USB
|
8051; SMBUS; SPI; VBUS
|
| Clock Frequency-Max |
25 MHz
|
|
| Data Transfer Rate-Max |
625 MBps
|
|
| JESD-30 Code |
S-XQCC-N72
|
S-XQCC-N72
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
10 mm
|
| Number of Terminals |
72
|
72
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC72,.39SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
1173 mA
|
|
| Supply Voltage-Max |
1.31 V
|
|
| Supply Voltage-Min |
1.22 V
|
|
| Supply Voltage-Nom |
1.25 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare USB5537B-6080AKZE with alternatives
Compare USB5537-AKZE-XX with alternatives