VSC7420XJQ-02
vs
TLK10034AAJ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HTFQFP, TQFP302,1SQ
|
FCBGA-324
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2019-10-10
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| JESD-30 Code |
S-PQFP-G302
|
S-PBGA-B324
|
| Length |
24 mm
|
19 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
302
|
324
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
BGA
|
| Package Equivalence Code |
TQFP302,1SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Seated Height-Max |
1.2 mm
|
3.29 mm
|
| Supply Current-Max |
2 mA
|
1249 mA
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
SUPPORT CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
24 mm
|
19 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Data Rate |
|
10000000 Mbps
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
4
|
| Number of Transceivers |
|
4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare VSC7420XJQ-02 with alternatives
Compare TLK10034AAJ with alternatives