VSC7420XJQ-02
vs
VSC7420XJG-02
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HTFQFP, TQFP302,1SQ
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2019-10-10
|
2019-10-10
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
S-PQFP-G302
|
S-PBGA-B672
|
| Length |
24 mm
|
27 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
302
|
672
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
BGA
|
| Package Equivalence Code |
TQFP302,1SQ
|
BGA672,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Seated Height-Max |
1.2 mm
|
2.44 mm
|
| Supply Current-Max |
2 mA
|
2 mA
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
24 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
5A991.C
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
|
|
Compare VSC7420XJQ-02 with alternatives
Compare VSC7420XJG-02 with alternatives