VSC7428XJG-02
vs
AQR108-B0-EG-Y
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MARVELL SEMICONDUCTOR INC
|
Package Description |
BGA-672
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A991.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
JESD-30 Code |
S-PBGA-B672
|
R-PBGA-B104
|
Length |
27 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
672
|
104
|
Operating Temperature-Max |
125 °C
|
108 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
LFBGA
|
Package Equivalence Code |
BGA672,26X26,40
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
2.44 mm
|
1.57 mm
|
Supply Current-Max |
2100 mA
|
|
Supply Voltage-Nom |
1 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
7 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare VSC7428XJG-02 with alternatives
Compare AQR108-B0-EG-Y with alternatives