VSC7428XJG-02
vs
VSC8258YMR
feature comparison
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA-672
|
FCBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.C
|
5A002.A.1
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B256
|
| Length |
27 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
672
|
256
|
| Operating Temperature-Max |
125 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
BGA
|
| Package Equivalence Code |
BGA672,26X26,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
| Seated Height-Max |
2.44 mm
|
2.7 mm
|
| Supply Current-Max |
2100 mA
|
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
17 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
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