VSC8522XJQ-04
vs
AQR108-B0-EG-Y
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MARVELL SEMICONDUCTOR INC
|
Package Description |
HTFQFP,
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A991.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
JESD-30 Code |
S-PQFP-G302
|
R-PBGA-B104
|
Length |
24 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
302
|
104
|
Operating Temperature-Max |
125 °C
|
108 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
LFBGA
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
1.2 mm
|
1.57 mm
|
Supply Voltage-Nom |
1 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
OTHER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
24 mm
|
7 mm
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare VSC8522XJQ-04 with alternatives
Compare AQR108-B0-EG-Y with alternatives