VSC8522XJQ-04 vs VSC8574XKS-05 feature comparison

VSC8522XJQ-04 Microchip Technology Inc

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VSC8574XKS-05 Microchip Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description HTFQFP, BGA-256
Reach Compliance Code compliant compliant
ECCN Code 5A991.C 5A991.B
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microchip Microchip
JESD-30 Code S-PQFP-G302 S-PBGA-B256
Length 24 mm 17 mm
Number of Functions 1 1
Number of Terminals 302 256
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTFQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH GRID ARRAY
Seated Height-Max 1.2 mm 1.8 mm
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 1 mm
Terminal Position QUAD BOTTOM
Width 24 mm 17 mm
Base Number Matches 2 2
Factory Lead Time 9 Weeks
Data Rate 1000000 Mbps
Number of Transceivers 4
Package Equivalence Code BGA256,16X16,40
Supply Current-Max 980 mA

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