VSC8574XKS-05
vs
KSZ9031RNXIC
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
| JESD-30 Code |
S-PBGA-B256
|
S-XQCC-N48
|
| Length |
17 mm
|
7 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
48
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
BGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.8 mm
|
1 mm
|
| Supply Voltage-Nom |
1 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
7 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
4 Weeks
|
| Date Of Intro |
|
2016-03-14
|
| Data Rate |
|
1000000 Mbps
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
LCC48,.27SQ,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare VSC8574XKS-05 with alternatives
Compare KSZ9031RNXIC with alternatives